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Technical parameters

Key specs

Logic elements256
I/O count118
Core voltage1.7 ~ 1.9 VMax 1.9 V (Commercial TA = 0°C to +70°C)

Datasheet-verified parameters

26 items
ParameterValue and test conditionsSource
Macrocells256
User I/O118
Supply voltage for internal logic and input buffersMin 1.7 V, Max 1.9 V (Commercial TA = 0°C to +70°C)
Package TypeThin Quad Flat Pack (TQFP), 20mm x 20mm, 0.5mm pin spacing
Operating TemperatureCommercial: 0°C to +70°C
Temperature GradeCommercial (C)
RoHS CompliancePb-free available for all packages
Standby currentTyp 33 μA, Max 150 μA (Commercial, VCC = 1.9V, VCCIO = 3.6V)
Dynamic currentMax 27 mA (f = 50 MHz)
Propagation delay single p-termMax 6.7 ns (-7 speed grade)
Maximum system frequencyMax 152 MHz (F_SYSTEM1, -7 speed grade)
Maximum external frequencyMax 114 MHz (F_EXT1, -7 speed grade)
Configuration timeMax 150 μs
Storage Temperature-65 to +150 °C
Junction Temperature+150 °C
I/O Voltage Range1.5V to 3.3V
Process Technology0.18 micron CMOS
Thermal Resistance (Junction to Ambient)37.2 C/Watt
Thermal Resistance (Junction to Case)7.2 C/Watt
Input leakage currentMax +/-1 μA (VIN = 0V or VCCIO to 3.9V)
I/O capacitanceMax 10 pF (f = 1 MHz)
JTAG input capacitanceMax 10 pF (f = 1 MHz)
Global clock input capacitanceMax 12 pF (f = 1 MHz)
Absolute Maximum Rating - Supply voltage-0.5 to 2.0 V
Absolute Maximum Rating - Supply voltage for output drivers-0.5 to 4.0 V
Absolute Maximum Rating - Input voltage-0.5 to 4.0 V
All parameters (16)ExpandCollapse
Power
Voltage Supply - Internal1.7V ~ 1.9V
AC and DC characteristics
Delay Time tpd(1) Max6.7 ns
Environment and package
Mounting TypeSurface Mount
Operating Temperature0°C~70°C(TA)
PackageTray
Package / Case100-LQFP
Supplier Device Package100-TQFP (14x14)
Other
Base Product NumberXC2C256
MfrAMD Xilinx
Number of Gates6000
Number of I/O118
Number of Logic Elements/Blocks16
Number of Macrocells256
Product StatusActive
Programmable TypeIn System Programmable
SeriesCoolRunner II

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