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Technical parameters

Environment and package
Flash Size-
Operating Temperature-40°C~125°C(TJ)
PackageTray
Package / Case484-BBGA, FCBGA
RAM Size256KB
Supplier Device Package484-FCBGA (23x23)
Other
ArchitectureMCU, FPGA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
MfrAMD Xilinx
Number of I/O130
PeripheralsDMA
Primary AttributesKintex™-7 FPGA, 125K Logic Cells
Product StatusObsolete
SeriesAutomotive, AEC-Q100, Zynq®-7000 XA
Speed667MHz

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