Lumissil MicrosystemsUnited States
MULTI-CPU HETEROGENEOUS MULTI-AP
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View full reportTechnical parameters
| Power | |
|---|---|
| Voltage - I/O | 1.8V, 3.3V |
| Environment and package | |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C~85°C(TA) |
| Package | Tray |
| Package / Case | 270-LFBGA |
| Supplier Device Package | 270-BGA (12x12) |
| Other | |
| Additional Interfaces | DMA, I²C, I²S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG |
| Co-Processors/DSP | - |
| Core Processor | XBurst® 2 |
| Display & Interface Controllers | DVP, LCD, MIPI-CSI, MIPI-DSI |
| Ethernet | 10/100/1000Mbps (1) |
| Graphics Acceleration | No |
| Mfr | Lumissil Microsystems |
| Number of Cores/Bus Width | - |
| Product Status | Active |
| RAM Controllers | LPDDR3 |
| SATA | - |
| Security Features | AES, RSA, TRNG, MD5, SHA, SHA2 |
| Series | - |
| Speed | 1.2GHz |
| USB | USB 2.0 OTG (1) |