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View full reportTechnical parameters
| Environment and package | |
|---|---|
| 封装 | Wafer/Module/DFN8 |
| Other | |
| 存储 | 480KB |
| 安全算法 | DES/TDES/AES |
| 应用 | 电信卡、车联网、物联网、安全与防伪等领域 |
| 接口 | ISO7816/GPIO/I2C |
Documents
No documents are linked to this part yet.
| Environment and package | |
|---|---|
| 封装 | Wafer/Module/DFN8 |
| Other | |
| 存储 | 480KB |
| 安全算法 | DES/TDES/AES |
| 应用 | 电信卡、车联网、物联网、安全与防伪等领域 |
| 接口 | ISO7816/GPIO/I2C |
No documents are linked to this part yet.