CUI DevicesUnited States
HEATSINK HALF BRICK ALUM BLACK
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Fin Height | 0.940" (23.88mm) |
| Package | Box |
| Package Cooled | Half Brick DC/DC Converter |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 2.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 4.70°C/W |
| Other | |
| Attachment Method | Bolt On |
| Diameter | - |
| Length | 2.402" (61.00mm) |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Mfr | CUI Devices |
| Product Status | Obsolete |
| Series | - |
| Shape | Square, Fins |
| Type | Board Level |
| Width | 2.283" (58.00mm) |