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Technical parameters

Environment and package
PackageBag
Package AcceptedNon Specific
Size / Dimension1.000" L x 1.402" W (25.40mm x 35.60mm)
Other
Board Thickness0.031" (0.79mm) 1/32"
MaterialFR4 Epoxy Glass
MfrCapital Advanced Technologies
Number of Positions14
Pitch-
Product StatusActive
Proto Board TypeThrough Hole to SIP
Series5000, UNI-SIP™

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