Chip Quik Inc.United States
THERMALLY STABLE SOLDER PASTE NO
All alternatives
View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Storage/Refrigeration Temperature | 68°F~77°F(20°C~25°C) |
| Other | |
| Base Product Number | TS391L |
| Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
| Diameter | - |
| Flux Type | No-Clean |
| Form | Jar, 1.76 oz (50g) |
| Melting Point | 281°F (138°C) |
| Mesh Type | 4 |
| Mfr | Chip Quik Inc. |
| Process | Lead Free |
| Product Status | Active |
| Series | - |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | - |
| Type | Solder Paste |
| Wire Gauge | - |