RKG PACAKGE 39 PINS (TOP VIEW)
Texas InstrumentsUnited States
IC REG BUCK SYNC 2.95V-6V 6A 39-BQFN
TPS84610RKG is a 2.95V to 6V input, 6A output synchronous buck DC-DC converter in a 9x11x2.8mm BQFN package, integrating power MOSFETs and inductor, with up to 96% efficiency and operating temperature of -40°C to 85°C.Checked against the datasheet
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Technical parameters
Key specs
Input voltage2.95 ~ 6 V
Output voltage800 mV ~ 3.6 V
Output current6 AMax
Switching frequency500 kHz ~ 2 MHz
Datasheet-verified parameters
24 items| Parameter | Value and test conditions | Source |
|---|---|---|
| Input Voltage Range | 2.95-V to 6-V | |
| Output Voltage | 0.8 V to 3.6 V | |
| Output Current | 6-A | |
| Switching Frequency | 500 kHz to 2 MHz | |
| Package | BQFN (9×11×2.8 mm) | |
| Operating Temperature Range | -40°C to 85°C |
All parameters (7)
| Power | |
|---|---|
| Input Voltage | 2.95 V (Min) to 6 V (Max) |
| Output Current | 6 A (Max) |
| Output Voltage Adjust Range | 0.8 V (Min) to 3.6 V (Max) |
| AC and DC characteristics | |
| Switching Frequency | 500 kHz (Typ) |
| Environment and package | |
| Junction-to-ambient thermal resistance | 12 °C/W |
| Operating Temperature Range | -40°C to 85°C |
| Package | 9×11×2.8 mm BQFN |
Pinout and package
RKG PACAKGE 39 PINS (TOP VIEW)
| Pin | Name | Function | Source |
|---|---|---|---|
| 1 | AGND: Zero VDC reference for the analog control circuitry. Should be connected directly to the PCB analog ground plane. | ||
| 2 | DNC: Do Not Connect. Do not connect these pins to AGND, to another DNC pin, or to any other voltage. | ||
| 3 | DNC: Do Not Connect. Do not connect these pins to AGND, to another DNC pin, or to any other voltage. | ||
| 4 | RT/CLK: Automatically selects between RT mode and CLK mode. An external timing resistor adjusts the switching frequency. In CLK mode, the device synchronizes to an external clock. | ||
| 5 | AGND: Zero VDC reference for the analog control circuitry. Should be connected directly to the PCB analog ground plane. | ||
| 6 | SS/TR: Slow-start and tracking pin. Connecting an external capacitor adjusts the output voltage rise time. A voltage applied allows for tracking and sequencing control. | ||
| 7 | STSEL: Slow-start or track feature select. Connect to AGND to enable internal SS capacitor (~1.1 ms). Leave open to enable TR feature. | ||
| 8 | VOUT: Output voltage. Connect output capacitors between these pins and the PGND plane, close to the device. | ||
| 9 | VOUT: Output voltage. Connect output capacitors between these pins and the PGND plane, close to the device. | ||
| 10 | VOUT: Output voltage. Connect output capacitors between these pins and the PGND plane, close to the device. | ||
| 11 | VOUT: Output voltage. Connect output capacitors between these pins and the PGND plane, close to the device. | ||
| 12 | VOUT: Output voltage. Connect output capacitors between these pins and the PGND plane, close to the device. | ||
| 13 | VOUT: Output voltage. Connect output capacitors between these pins and the PGND plane, close to the device. | ||
| 14 | VOUT: Output voltage. Connect output capacitors between these pins and the PGND plane, close to the device. | ||
| 15 | DNC: Do Not Connect. Do not connect these pins to AGND, to another DNC pin, or to any other voltage. | ||
| 16 | DNC: Do Not Connect. Do not connect these pins to AGND, to another DNC pin, or to any other voltage. | ||
| 17 | PH: Phase switch node. Should be connected by a small copper island under the device for thermal relief. Do not connect any external component. | ||
| 18 | PH: Phase switch node. Should be connected by a small copper island under the device for thermal relief. Do not connect any external component. | ||
| 19 | PH: Phase switch node. Should be connected by a small copper island under the device for thermal relief. Do not connect any external component. | ||
| 20 | PH: Phase switch node. Should be connected by a small copper island under the device for thermal relief. Do not connect any external component. | ||
| 21 | PH: Phase switch node. Should be connected by a small copper island under the device for thermal relief. Do not connect any external component. | ||
| 22 | PH: Phase switch node. Should be connected by a small copper island under the device for thermal relief. Do not connect any external component. | ||
| 23 | PH: Phase switch node. Should be connected by a small copper island under the device for thermal relief. Do not connect any external component. | ||
| 24 | PH: Phase switch node. Should be connected by a small copper island under the device for thermal relief. Do not connect any external component. | ||
| 25 | PH: Phase switch node. Should be connected by a small copper island under the device for thermal relief. Do not connect any external component. | ||
| 26 | DNC: Do Not Connect. Do not connect these pins to AGND, to another DNC pin, or to any other voltage. | ||
| 27 | PWRGD: Power good fault pin. Asserts low if the output voltage is out of tolerance. A pull-up resistor is required. | ||
| 28 | INH/UVLO: Inhibit and UVLO adjust pin. Use open drain or open collector logic to control INH. A resistor between this pin and AGND adjusts UVLO voltage. | ||
| 29 | AGND: Zero VDC reference for the analog control circuitry. Should be connected directly to the PCB analog ground plane. | ||
| 30 | VIN: Positive input voltage power pins, referenced to PGND. Connect external input capacitance between these pins and the PGND plane, close to the device. | ||
| 31 | VIN: Positive input voltage power pins, referenced to PGND. Connect external input capacitance between these pins and the PGND plane, close to the device. | ||
| 32 | VIN: Positive input voltage power pins, referenced to PGND. Connect external input capacitance between these pins and the PGND plane, close to the device. | ||
| 33 | AGND: Zero VDC reference for the analog control circuitry. Should be connected directly to the PCB analog ground plane. | ||
| 34 | AGND: Zero VDC reference for the analog control circuitry. Should be connected directly to the PCB analog ground plane. | ||
| 35 | VADJ: Connecting a resistor between this pin and AGND sets the output voltage above the 0.8V default voltage. | ||
| 36 | SENSE+: Remote sense connection. Connect this pin to VOUT at the load for improved regulation. Must be connected to VOUT at the load or module pins. | ||
| 37 | PowerPAD (PGND): Provides electrical and thermal connection to the PCB. Should be connected directly to the PCB power ground plane using multiple vias. | ||
| 38 | VOUT: Output voltage. Connect output capacitors between these pins and the PGND plane, close to the device. | ||
| 39 | PH: Phase switch node. Should be connected by a small copper island under the device for thermal relief. Do not connect any external component. |
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