Chip Quik Inc.United States
SOLDER SPHERES SN96.5/AG3.0/CU0.
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Storage/Refrigeration Temperature | - |
| Other | |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter | 0.008" (0.20mm) |
| Flux Type | - |
| Form | Jar |
| Melting Point | 423 ~ 428°F (217 ~ 220°C) |
| Mfr | Chip Quik Inc. |
| Process | Lead Free |
| Product Status | Active |
| Series | SMD2 |
| Shelf Life | 24 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | - |
| Type | Solder Sphere |
| Weight | - |
| Wire Gauge | - |