SOIC-8 (Exposed Pad)

SOIC-8 (Exposed Pad)

SGMICRO(圣邦微)China

SGM61430XPS8G/TR

Voltage Regulators - DC DC Switching RegulatorsSOIC-8

IC DC-DC CONV BUCK 4.5V-36V 3A SOIC-8-EP

SGM61430 is a synchronous Buck converter with 4.5V to 36V input, 3A output, in SOIC-8 (Exposed Pad) package, operating from -40°C to +125°C, featuring PFM light load mode and low quiescent current.Checked against the datasheet

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Technical parameters

Key specs

Input voltage4.5 ~ 36 V
Output voltage800 mV ~ 24 V
Output current3 AMax
Switching frequency390 kHz

Datasheet-verified parameters

24 items
ParameterValue and test conditionsSource
Input Voltage Range4.5V to 36V
Output Voltage Range0.8V to 24V
Output CurrentUp to 3A Continuous
Switching Frequency390kHz (Normal Operation)
PackageSOIC-8 (Exposed Pad)
Operating Temperature Range-40℃ to +125℃
RoHSGreen (RoHS & HSF)
Halogen FreeFree of halogen substances
Quiescent Current64μA (TYP), VIN = 12V, VFB = 0.9V, Non-switching
Shutdown Current0.6μA (TYP), VIN = 6V to 36V, VEN = 0V
Input UVLO Rising Threshold4.1V (Min), 4.3V (Typ), 4.5V (Max)
Enable Rising Threshold1.35V (Min), 1.50V (Typ), 1.65V (Max)
Reference Voltage0.782V (Min), 0.804V (Typ), 0.824V (Max) at TJ = +25°C
Internal LDO Output Voltage4.6V (Min), 5.0V (Typ), 5.3V (Max)
Peak Inductor Current Limit5.0A (Min), 5.9A (Typ), 6.8A (Max) at TJ = +25°C
Valley Inductor Current Limit2.2A (Min), 2.9A (Typ), 3.5A (Max) at TJ = +25°C
High-side MOSFET On-Resistance115mΩ (TYP), VIN = 12V, IOUT = 0.5A
Low-side MOSFET On-Resistance90mΩ (TYP), VIN = 12V, IOUT = 0.5A
Thermal Shutdown Threshold175°C (Typ)
Thermal Shutdown Hysteresis20°C (Typ)
Absolute Maximum Input Voltage-0.3V to 42V (VIN to PGND)
Junction Temperature+150°C
Storage Temperature Range-65℃ to +150℃
Soft-Start Time1.5ms (TYP)
All parameters (10)ExpandCollapse
Power
Input Voltage Range4.5V to 36V
Output Current Range0A to 3A
Output Voltage Range0.8V to 24V
Quiescent Current into VIN64 μA (Typ)
Shutdown Current into VIN0.6 μA (Typ)
AC and DC characteristics
Switching Frequency390kHz
Environment and package
Operating Ambient Temperature Range-40℃ to +125℃
PackageSOIC-8 (Exposed Pad)
Other
High-side MOSFET On-Resistance115 mΩ (Typ)
Low-side MOSFET On-Resistance90 mΩ (Typ)

Pinout and package

SOIC-8 (Exposed Pad)
SOIC-8 (Exposed Pad)
Package: SOIC-8 (Exposed Pad)
PinNameFunctionSource
1SW: Switching Node Output. Switching node of the internal synchronous Buck converter. Connect to the output inductor and bootstrap capacitor.
2BOOT: Bootstrap Input. Bootstrap supply for high-side driver. Connect a 470nF ceramic capacitor between BOOT and SW pins.
3VCC: LDO (Internal Bias) Output. This pin is provided for bypassing to AGND only. Never load VCC.
4FB: Feedback Input. Connect the midpoint of the feedback resistor divider.
5EN/SYNC: Active High Enable and Synchronous Input. Do not float. EN: Can be connected to VIN via resistor or divider to adjust UVLO. SYNC: External clock can be coupled via small capacitor to synchronize internal oscillator.
6AGND: Analog Ground. Reference for internal analog signals and logic. Connect it to system ground.
7VIN: Power Supply Input Pin. Connect CIN as close as possible between this pin and PGND pin.
8PGND: Power Ground. Internally connected to converter return. Returns of CIN and COUT capacitors should be connected close to this pin. Connect to system ground, exposed pad and AGND together.
Exposed PadExposed Pad: Thermal Exposed Pad. Must be connected to ground plane on PCB. It is the main thermal relief path for the die.

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DatasheetDatasheet · 923.6 KB · 2026-10-29
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