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Technical parameters

Environment and package
High temperature exposure85 °C, 96 h
Low temperature exposure- 40 °C, 96 h
Operating temperature range- 40 ~ 85 °C
Storage temperature range- 40 ~ 85 °C
Thermal shock- 40 (0.5 h) ~ 85 °C (0.5 h), 5 cycles
Other
Adjustment torque4 ~ 20 mN·m {41 ~ 204 gf·cm}
Circuit typeBCD (Real code, complementary code) BCH (Real code, complementary code)
Contact ratingNon-switching: 100 mA 50 VDCSwitching: 100 mA 5 VDCMinimum: 1 μA 20 mVDC
Contact resistance100 mΩ maximum
Dielectric strength250 VAC, 60 s
HumidityResistance load 50 VDC 100 mA 40 °C, Relative humidity 90 ~ 95 %, 240 h
Insulation resistance1000 MΩ (100 VDC) minimum
Load life20000 steps
Net weightWithout knob Top setting type: 0.63 g With knob Top setting type: 0.73 gWithout knob Side setting type: 0.76 g With knob Side setting type: 0.86 g
No. of positions16 (SC-1000), 10 (SC-2000)
Pull-off strength (Gull wing only)5 N {0.51 kgf}, 10 s
SealingWashable
Shear (Gull wing only)5 N {0.51 kgf}, 10 s
Shock490 m/s2, 11 ms 6 directions for 3 times each
Solderability245 ± 3 °C, 2 ~ 3 s
Soldering heatGull wing: Reflow: Peak temperature 255 °C (Please refer to the profile below.) Manual soldering: 350 ± 10 °C, 3 ~ 4 s Through hole pin: Flow: 260 ± 3 °C as the temperature in a pot of molten solder, immersion from head of terminal to backside of board 5 ~ 6 s, two times maximum Manual soldering: 380 ± 10 °C, 3 ~ 4 s
Solvent resistance (Dipping)Solvent: IPA (Isopropyl alchol), Temperature: 23 ± 5 °C, Time: 5 ± 0.5 minutes
Stepping angle22.5° (SC-1000), 36° (SC-2000)
Stop strength (With knob only)10 N {1.02 kgf}, 10 s
Substrate bending (Gull wing only)Width 90 mm, bend 3 mm, 5 s, 1 time
Terminal strength (Through hole pin only)10 N {1.02 kgf} minimum
VibrationAmplitude 1.5 mm or Acceleration 98 m/s2,10-500-10 Hz, 3 directions for 2 h each

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