Chip Quik Inc.United States
LG SOLDER-IN BREADBOARD 1600 PLA
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Size / Dimension | 4.20" L x 4.10" W (106.7mm x 104.1mm) |
| Other | |
| Base Product Number | SBBTH |
| Board Thickness | 0.063" (1.60mm) |
| Circuit Pattern | Pad Per Hole (Round) |
| Edge Contacts | - |
| Hole Diameter | 0.039" (1.00mm) |
| Material | FR4 Epoxy Glass |
| Mfr | Chip Quik Inc. |
| Pitch | 0.1" (2.54mm) Grid |
| Plating | Plated Surface Mount |
| Product Status | Active |
| Proto Board Type | Breadboard, General Purpose |
| Series | Proto-Advantage |
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