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Technical parameters

Datasheet-verified parameters

12 items
ParameterValue and test conditionsSource
PackageSMD Package (35.4x18X3.85mm)
Maximum link budget166dB
Output power+27 dBm @868 MHz band
Programmable bit rateup to 300 kbps
Sensitivitydown to -136dBm
ModulationFSK, GFSK, MSK, GMSK, LoRa and OOK
Packet engine sizeup to 256 bytes with CRC
Power supply voltage5.0-6.4V
3.3V Voltage output3.3V
TX Working currentTyp 650 mA, Max 700 mA @868MHz band, Pout = +27dBm
RX Working currentTyp 13 mA, Max 15 mA @868MHz band
Sleep currentTyp 5 uA, Max 12 uA @All band
All parameters (7)ExpandCollapse
Power
Output Power+27 dBm
Supply Voltage5.0-6.4V
AC and DC characteristics
Frequency868MHz
Environment and package
Operating Temperature-20 to +70 °C
PackageSMD Package (35.4x18X3.85mm)
Other
ModulationLoRa
Sensitivity-136dBm

Pinout and package

Figure 1. RFM98PW/RFM95PW Pin …
Figure 1. RFM98PW/RFM95PW Pin …
Package: SMD Package (35.4x18X3.85mm)
PinNameFunctionSource
1ANT, RF signal input/output
2GND, Power ground
3DIO3, Digital I/O, software configured
4DIO4, Digital I/O, software configured
5VCC, Positive power supply, 5.0-6.4V
6DIO0, Digital I/O, software configured
7DIO1/DCLK, Digital I/O, software configured
8DIO2/DATA, Digital I/O, software configured
93.3V, 3.3V Voltage output. For MCU VCC
10MISO, SPI Data output
11MOSI, SPI Data input
12SCK, SPI Clock input
13NSS, SPI Chip select input
14RESET, Reset trigger input
15DIO5, Digital I/O, software configured
16GND, Power ground
17GND, Power ground, This area is connected to the GND network of the main board for heat radiation

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