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Technical parameters

Power
Operating voltage3.3 V
Power consumption typ.tbd.
AC and DC characteristics
Clock frequencyup to 1 GHz (A53), up to 800 MHz (R5F), up to 400 MHz (M4F)
Environment and package
Dimensions70 mm x 39 mm x 7.6 mm
Operating temperature-40 °C to +85 °C
Other
A/Dup to 8
CAN2x CAN FD
Configuration memory16 MB QSPI Flash
Connector400-Pin Samtec, 0.5 mm pitch
Coprocessorup to 4x Arm® Cortex®-R5F, Arm® Cortex®-M4F
Coreup to 2x Arm® Cortex®-A53
DDR41 GB up to 2 GB
DebuggingJTAG
EEPROM4 kB up to 32 kB
Embedded memory1944 kbit
eMMC4 GB up to 128 GB
Ethernet2x Gigabit (1x on-board PHY / 1x RGMII), 4x Gigabit Industrial (PRU-ICSSG)
FPGALattice ECP5 LFE5U-45
FPGA-I/O92x
GPMCyes
Humidity95 % rF non condensing
HW Security3DES, AES, DRBG, MD5, PKA, SHA-1, SHA-2
I²Cup to 6
Internal RAM2 MB SRAM with ECC
L2 Cache256 kB with ECC
LTUs44 k
MMC/SD/SDIO1
NOR Flash64 MB up to 256 MB (Octal SPI/Dual SPI Flash)
Operating systemLinux (Yocto based)
PCI / PCIe1x PCIe 2.0
ProcessorTI AM6411, TI AM6412, TI AM6421, TI AM6422, TI AM6441, TI AM6442
Programmable I/Os92 (LVTTL / LVDS)
PWMup to 9
Real-time operating systemfreeRTOS
RTCon-board
SPIup to 7
sysDSP™54-bit ALU, 72 18x18 Multipliers
sysMEM™108 x 18 kbit
UARTup to 9
USB1x 2.0 Dual Role, 1x 3.1 Dual Role
Weighttbd.

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