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Technical parameters

Power
Max Power Rating (dBm)30
Environment and package
Max Temp (ºC)85
Package32L LGA
Package (mm)5x5
Other
DescriptionSP4T (A)
ECCNEAR99
ESD HBM (V)2000
IIP3 (dBm)58
Max Freq.8 GHz
Max Typ. IL (dB)1.2
Min Freq.10 Hz
Min Typ. Iso (dB)27
P1dB/P0.1dB (dBm)33.0 / –
PCN/EOLPCN – August 31, 2021: Manufacturing Site, Ordering codes change PCN – September 14, 2018: Electrical Test – location change, Manufacturing Site – assembly site change, Ordering codes change PCN – November 17, 2017: Wafer Fabrication Process, Ordering codes change PCN – February 15, 2017: Assembly Process – New package laminate, Ordering codes change
Switching Time5 µs
Typ. IL (dB)0.7
Typ. Iso (dB)84
VDD Range (V)3.0–3.6

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