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Technical parameters

Environment and package
Inner Dimension0.194" L x 0.155" W (4.93mm x 3.94mm)
Outer Dimension1.300" L x 0.900" W (33.02mm x 22.86mm)
PackageBulk
Thermal Center Pad-
Other
MaterialStainless Steel
MfrChip Quik Inc.
Number of Positions8
Pitch0.050" (1.27mm)
Product StatusActive
SeriesProto-Advantage PA
Thickness0.0040" (0.102mm)
TypePSOP

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