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Technical parameters

Environment and package
PackageBulk
Package AcceptedSOIC
Size / Dimension0.800" L x 0.700" W (20.32mm x 17.78mm)
Other
Base Product NumberPA0006
Board Thickness0.063" (1.60mm)
MaterialFR4 Epoxy Glass
MfrChip Quik Inc.
Number of Positions16
Pitch0.050" (1.27mm)
Product StatusActive
Proto Board TypeSMD to DIP
SeriesProto-Advantage

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