I-PEXJapan
Fully-shielded, 1.2 mm mated height, 0.35 mm pitch, power contact-equipped, up to 40 Gbps per lane supporting board-to-board connector
All alternatives
View full reportTechnical parameters
| Power | |
|---|---|
| Current Rating | Signal: 0.3 A/pinPower: 4.5 A/pin x 4 |
| Environment and package | |
| Mated Height | 1.2 +/- 0.05 mm |
| Operating Temperature | -40 to 85℃ (233 to 358 K) |
| Other | |
| Applicable Standards (Reference Only) | USB4 (20 Gbps/lane)USB3.1 Gen2 (10 Gbps/lane)eDP HBR3 (8.1 Gbps/lane)eDP HBR2 (5.4 Gbps/lane)HDMI 2.1 (12 Gbps/lane)V-By-One HS 1.4 (4 Gbps/lane)MiPi standards |
| Available Pin Count | Signal+Power: 22+4, 56+4, 62+4 |
| Contact Pitch | 0.35 mm |
| Depth | 3.7 mm |
| Full EMI Shielding (ZenShield®) | Yes |
| Product Type | Board-to-Board |
| Transmission Speed (Reference Only) | 40 Gbps/lane NRZ |
| Width | 4.86 + (0.35 x pin count/2) mm |
Documents
DatasheetDatasheet · 3.5 MB · 2026-09-24DatasheetDatasheet · 418.1 KB · 2026-09-24Package DrawingPackage Drawing · 2.4 MB · 2026-09-24Models & CADModels & CAD · 1.8 MB · 2026-09-24Models & CADModels & CAD · 1.7 MB · 2026-09-24Package DrawingPackage Drawing · 1.6 MB · 2026-09-24Models & CADModels & CAD · 1.5 MB · 2026-09-24Models & CADModels & CAD · 1.4 MB · 2026-09-24Package DrawingPackage Drawing · 1.2 MB · 2026-09-24User ManualUser Manual · 1.2 MB · 2026-09-24Models & CADModels & CAD · 1.1 MB · 2026-09-24Models & CADModels & CAD · 821.4 KB · 2026-09-24Catalog & SelectionCatalog & Selection · 733.9 KB · 2026-09-24Package DrawingPackage Drawing · 535.7 KB · 2026-09-24Package DrawingPackage Drawing · 521.4 KB · 2026-09-24OtherOther · 421.9 KB · 2026-09-24EnvironmentalEnvironmental · 147.1 KB · 2026-09-24OtherOther · 107.6 KB · 2026-09-24EnvironmentalEnvironmental · 107.2 KB · 2026-09-24
Open document center