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Technical parameters

Power
Power supply3.3 V
AC and DC characteristics
Frequencyup to 4x 1.6 GHz (Consumer: up to 1.8 GHz) (A53), 400 MHz (M4)
Environment and package
Dimensions40 mm x 37 mm
Temperature range-40°C to +85°C
Other
ArchitectureARM Cortex-A53 / Cortex-M4
Audio4x SAI + Immersiv3D plus Dolby Atmos & AC4 or DTS Decoding
Bit width64 bit
Camera1x MIPI CSI-2
Connectors319 solder pads, 1.27 mm pitch Fused Tin Grid Array (FTGA) + 4 GND
DisplayLVDS or MIPI DSI-2
EEPROM4 kB
eMMC4 GB - 256 GB
Ethernet1x 10/100/1000 Mbit/s
GraphicsVivante GC NanoUltra 3D (1 shader) + GC30 2D (6.4 GFLOPs)
I²C3x
MMC/SD/SDIO3x SDIO (1x for EMMC)
Operating systemLinux (Yocto based), Android
PCle1x
Processori.MX8M Mini Quad / i.MX8M Mini Dual / i.MX8M Mini Solo / i.MX8M Mini QuadLite / i.MX8M Mini DualLite / i.MX8M Mini SoloLite
PWMup to 4x
RAM512 MB - 4 GB (32 Bit)
RTCLow power, high precision external RTC
SecurityAES, RSA, SHA-256, 3DES, DES, ECC, ARC4, MD5, TRNG
SPI2x FlexSPI + 3x ECSPI
SPI NOR Flash8 MB - 256 MB
UART4x
USB2x USB 2.0 OTG
Video1080p encode and decode (i.MX 8M Mini only)

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