All alternatives
View full report10 alternatives on file, including 2 Chinese alternatives. Sign in to view them.
Technical parameters
Key specs
Data rate20 MbpsMax
| Power | |
|---|---|
| 低功耗 | 1 |
| 低功耗模式 | 1 |
| 最大供电电压 | 27V |
| 最大工作电压 | 27V |
| 最小供电电压 | 5V |
| 最小工作电压 | 5V |
| 母线故障电压 | 40V |
| 静态功耗 | 3mA |
| 静态工作功耗 | 3mA |
| Environment and package | |
| 封装类型1 | SOIC |
| 最大工作温度 | 125℃ |
| 最小工作温度 | -40℃ |
| Other | |
| ESD(HBM) | 8KV |
| HBM ESD | 8KV |
| 使能 | 1 |
| 使能关断 | 1 |
| 唤醒 | 1 |
| 唤醒功能 | 1 |
| 引脚数量1 | 8 |
| 数据传输率 | 20Mbps |
| 最大数据速率 | 20Mbps |
| 静电放电抗扰 | 6KV |
Documents
No documents are linked to this part yet.