Bantam ToolsUnited States

KT1016

ActiveEducational Kits

HEAT SINK EXPERIMENT KIT

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Technical parameters

Environment and package
PackageBulk
Other
Included MCU/MPU Board(s)-
Interconnect System-
Kit TypePhysical Science
Main PurposeThermal Transfer
MfrBantam Tools
Product StatusActive
Series-
Suggested Programming Environment-
Utilized IC / Part-

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