Figure 1. 153-FBGA

Figure 1. 153-FBGA

SAMSUNGSouth Korea

KLMBG2JETD-B041

Memory153FBGA

EMMC 5.1 16GB 153-BALL BGA

Samsung 32GB eMMC 5.1 memory, 153FBGA package, supports HS400 mode, interface voltage 1.70V~1.95V or 2.7V~3.6V, core voltage 2.7V~3.6V.Checked against the datasheet

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Technical parameters

Key specs

InterfaceSD / eMMC

Datasheet-verified parameters

9 items
ParameterValue and test conditionsSource
Memory TypeeMMC 5.1
Capacity32 GB
InterfaceeMMC 5.1 Specification compatibility
Supply VoltageInterface power : VDD (1.70V ~ 1.95V or 2.7V ~ 3.6V) - Memory power : VDDF (2.7V ~ 3.6V)
Package153FBGA, 11.5mm x 13mm x 0.8mm
NAND Flash Type128Gb x 2
User Density91.0%
Operating ModeHS400 mode
Pin Configuration153 Ball
All parameters (4)ExpandCollapse
Environment and package
Package153 Ball BGA
Package Dimension11.5mm x 13mm x 0.8mm
Other
Capacity16GB
SpecificationeMMC 5.1

Pinout and package

Figure 1. 153-FBGA
Figure 1. 153-FBGA
Package: 153FBGA, 11.5mm x 13mm x 0.8mm
PinNameFunctionSource
A3Data bit 0 (DAT0)
A4Data bit 1 (DAT1)
A5Data bit 2 (DAT2)
A6Ground (VSS)
B2Data bit 3 (DAT3)
B3Data bit 4 (DAT4)
B4Data bit 5 (DAT5)
B5Data bit 6 (DAT6)
B6Data bit 7 (DAT7)
C2I/OPower (VDDI)
C4Ground (VSS)
C6I/OPower (VCCQ)
E6Core Power (VCC)
E7Ground (VSS)
F5Core Power (VCC)
G5Ground (VSS)
H10Ground (VSS)
H5Data Strobe
J10Core Power (VCC)
J5Ground (VSS)
K5Reset signal (RSTN)
K8Ground (VSS)
K9Core Power (VCC)
M4I/OPower (VCCQ)
M5Command signal (CMD)
M6Clock signal (CLK)
N2Ground (VSS)
N4I/OPower (VCCQ)
N5Ground (VSS)
P3I/OPower (VCCQ)
P4Ground (VSS)
P5I/OPower (VCCQ)
P6Ground (VSS)

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DatasheetDatasheet · 420.7 KB · 2026-10-26
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