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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Storage/Refrigeration Temperature | - |
| Other | |
| Composition | Sn63Pb37 (63/37) |
| Diameter | - |
| Flux Type | No-Clean |
| Form | Syringe, 3.53 oz (100g) |
| Manufacturer | Chip Quik Inc. |
| Melting Point | 361°F (183°C) |
| Packaging | Bulk |
| Part Status | Active |
| Process | Leaded |
| Series | CHIPQUIK® |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | - |
| Type | Solder Paste |
| Weight | - |
| Wire Gauge | - |
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