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Technical parameters

Key specs

ChannelN-channel
Drain-source voltage100 VVGS = 0V,ID = 250μA
Continuous drain current1.5 ATc = 25°C,VGS = 5.0 V
On-resistance540 mΩMax · VGS = 5.0V,ID = 0.90A,VGS = 4.0V,ID = 0.75A
Gate threshold voltage2 VMax · VDS = VGS,ID = 250μA

Datasheet-verified parameters

25 items
ParameterValue and test conditionsSource
ChannelN-Channel
Drain-to-Source Breakdown VoltageMin 100 V, VGS = 0V, ID = 250μA
Continuous Drain CurrentMax 1.5 A @ Tc = 25°C, VGS = 5.0 V
Static Drain-to-Source On-ResistanceMax 0.54 Ω @ VGS = 5.0V, ID = 0.90A; Max 0.76 Ω @ VGS = 4.0V, ID = 0.75A
Gate Threshold VoltageMin 1.0 V, Max 2.0 V @ VDS = VGS, ID = 250μA
PackageSOT-223
Junction and Storage Temperature Range-55 to +150 °C
Pulsed Drain CurrentMax 12 A
Power DissipationMax 3.1 W @ Tc = 25°C
Gate-to-Source VoltageMax -/+10 V
Single Pulse Avalanche EnergyMax 50 mJ
Avalanche CurrentMax 1.5 A
Repetitive Avalanche EnergyMax 0.31 mJ
Peak Diode Recovery dv/dtMax 5.5 V/ns
Junction-to-PCB Thermal ResistanceMax 40 °C/W
Junction-to-Ambient Thermal ResistanceMax 60 °C/W (PCB Mount)
Forward TransconductanceMin 0.57 S @ VDS = 25V, ID = 0.90 A
Drain-to-Source Leakage CurrentMax 25 μA @ VDS = 100V, VGS = 0V; Max 250 μA @ VDS = 80V, VGS = 0V, TJ = 125°C
Gate-to-Source Forward LeakageMax 100 nA @ VGS = 10V
Total Gate ChargeMax 6.1 nC @ ID = 5.6A
Input CapacitanceTyp 250 pF @ VGS = 0V
Output CapacitanceTyp 80 pF @ VDS = 25V
Reverse Transfer CapacitanceTyp 15 pF @ f = 1.0MHz
Turn-On Delay TimeTyp 9.3 ns @ VDD = 50V
Turn-Off Delay TimeTyp 16 ns @ RG = 12Ω
All parameters (7)ExpandCollapse
Environment and package
PackageSOT-223
Other
I_{D} @ Tc = 25°C1.5 A (Max)
P_{D} @Tc = 25°C3.1 W (Max)
R_{DS(on)}0.54 Ω (Max)
T_{J}, T_{STG}-55 to +150 °C
V_{DSS}100V
V_{GS(th)}1.0 V (Min)

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