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Technical parameters

Environment and package
Inner Dimension0.102" L x 0.063" W (2.60mm x 1.60mm)
Outer Dimension1.300" L x 0.900" W (33.02mm x 22.86mm)
PackageBulk
Thermal Center Pad0.059" L x 0.047" W (1.50mm x 1.20mm)
Other
MaterialStainless Steel
MfrChip Quik Inc.
Number of Positions6
Pitch0.020" (0.50mm)
Product StatusActive
SeriesProto-Advantage IPC
Thickness0.0040" (0.102mm)
TypeDFN

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