CUI DevicesUnited States
HEAT SINK TO-252 COPPER
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Fin Height | 0.400" (10.16mm) |
| Package | Tape & Reel (TR) |
| Package Cooled | TO-252 (DPak) |
| Power Dissipation @ Temperature Rise | 2.1W@75°C |
| Thermal Resistance @ Forced Air Flow | 10.05°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 35.71°C/W |
| Other | |
| Attachment Method | - |
| Base Product Number | HSS-C52 |
| Diameter | - |
| Length | 0.315" (8.00mm) |
| Material | Copper |
| Material Finish | Tin |
| Mfr | CUI Devices |
| Product Status | Active |
| Series | HSS |
| Shape | Rectangular, Fins |
| Type | Top Mount |
| Width | 0.900" (22.86mm) |