CUI DevicesUnited States
HEATSINK TO-220 4.1W ALUMINUM
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Fin Height | 0.440" (11.18mm) |
| Package | Bag |
| Package Cooled | TO-220 |
| Power Dissipation @ Temperature Rise | 4.1W@75°C |
| Thermal Resistance @ Forced Air Flow | 6.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 18.34°C/W |
| Other | |
| Attachment Method | - |
| Base Product Number | HSS-B20 |
| Diameter | - |
| Length | 0.625" (15.90mm) |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Mfr | CUI Devices |
| Product Status | Active |
| Series | HSS |
| Shape | Rectangular, Fins |
| Type | Board Level |
| Width | 0.866" (22.00mm) |