Samtec Inc.United States
CONN IC DIP SOCKET 64POS GOLD
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View full reportTechnical parameters
Key specs
Pitch1.78 mm
| Environment and package | |
|---|---|
| Mounting Type | Through Hole |
| Operating Temperature | - |
| Package | Tube |
| Other | |
| Base Product Number | HIC-764 |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
| Contact Finish Thickness - Post | 200.0µin (5.08µm) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Contact Resistance | - |
| Features | Open Frame |
| Housing Material | Polyester, Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mfr | Samtec Inc. |
| Number of Positions or Pins (Grid) | 64 (2 x 32) |
| Pitch - Mating | 0.070" (1.78mm) |
| Pitch - Post | 0.070" (1.78mm) |
| Product Status | Obsolete |
| Series | HIC |
| Termination | Solder |
| Termination Post Length | 0.118" (3.00mm) |
| Type | DIP, 0.75" (19.05mm) Row Spacing |