BergquistUnited States
THERM PAD 36.83X21.29MM W/ADH
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Storage/Refrigeration Temperature | - |
| Thermal Conductivity | 0.8W/m-K |
| Thermal Resistivity | 0.35°C/W |
| Other | |
| Adhesive | Adhesive - One Side |
| Backing, Carrier | Fiberglass |
| Base Product Number | HF115AC |
| Color | Gray |
| Material | Phase Change Compound |
| Mfr | Bergquist |
| Outline | 36.83mm x 21.29mm |
| Product Status | Active |
| Series | Hi-Flow® 115-AC |
| Shape | Rectangular |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Thickness | 0.0055" (0.140mm) |
| Type | Pad, Sheet |
| Usage | SIP |