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View full reportTechnical parameters
| Power | |
|---|---|
| 最大工作电压 | 6V |
| 最小工作电压 | 2V |
| AC and DC characteristics | |
| 传播延迟时间 | 18.5ns |
| Environment and package | |
| 封装类型1 | SOIC |
| 封装类型2 | SOIC |
| 封装类型3 | SOIC |
| 封装类型4 | DIP |
| 封装类型5 | SOIC |
| 封装类型6 | TSSOP |
| 尺寸规格1 | 9.9*3.9*1.75mm |
| 尺寸规格2 | 5*4.4*1.1mm |
| 尺寸规格3 | 10.06*5.5*2.2mm |
| 尺寸规格4 | 19.2*7.62*5.06mm |
| 尺寸规格5 | 9.9*3.95*1.75mm |
| 尺寸规格6 | 5*4.4*1.1mm |
| Other | |
| 位数 | 4bit |
| 引脚数量1 | 16 |
| 引脚数量2 | 16 |
| 引脚数量3 | 16 |
| 引脚数量4 | 16 |
| 引脚数量5 | 16 |
| 引脚数量6 | 16 |
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