FFE-PAGE-46

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Available to adopt mount components of SMT(reflow), discrete(flow) and hand soldering. Both Pb-free and Pb-containing solder are available. Packaging; resin-coating and mold, can be consulted.

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Technical parameters

Applications	Hybrid IC, LED module, Power module etc.
Feature	To be making circuit board by mounting components on ceramic/glass epoxy substrate.
Name	PCB mounting
Overview	Available to adopt mount components of SMT(reflow), discrete(flow) and hand soldering. Both Pb-free and Pb-containing solder are available. Packaging; resin-coating and mold, can be consulted.

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