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Technical parameters

Environment and package
PackageBulk
Size / Dimension2.10" L x 1.26" W (53.3mm x 32.0mm)
Other
Base Product NumberEXN-23400
Board Thickness0.063" (1.60mm)
Circuit PatternPad Per Hole (Round)
Edge Contacts-
Hole Diameter0.051" (1.30mm)
MaterialFR4 Epoxy Glass
MfrBud Industries
Pitch0.100" (2.54mm)
PlatingPlated Through Hole (PTH)
Product StatusActive
Proto Board TypeBreadboard, General Purpose
SeriesEXN

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