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View full reportTechnical parameters
| Environment and package | |
|---|---|
| 封装类型1 | QFN |
| Other | |
| 0V电池充电功能 | 0 |
| APPLE协议 | 0 |
| BC1.2协议 | 0 |
| Dead battery support | 0 |
| MTK PE协议 | 0 |
| PD2.0 | 1 |
| PD2.0协议 | 1 |
| PD3.0 | 0 |
| PD3.0协议 | 0 |
| PD PPS | 0 |
| QC2.0 | 0 |
| QC2.0协议 | 0 |
| QC3.0 | 0 |
| QC3.0协议 | 0 |
| QC4.0 | 0 |
| QC4.0协议 | 0 |
| TYPE-C DFP | 0 |
| TYPE-C DRP | 0 |
| TYPE-C UFP | 0 |
| VOOC协议 | 0 |
| 三星AFC | 0 |
| 三星AFC协议 | 0 |
| 内置MCU | 1 |
| 内置VBUS开关 | 0 |
| 内置VBUS控制器 | 0 |
| 内置VCON开关 | 0 |
| 华为FCP | 0 |
| 华为FCP协议 | 0 |
| 华为SCP | 0 |
| 华为SCP协议 | 0 |
| 小米充电协议 | 0 |
| 小米快充协议 | 0 |
| 展讯SFCP | 0 |
| 展迅SFCP协议 | 0 |
| 引脚数量1 | 16 |
| 集成VBUS开关 | 0 |
| 集成VBUS开关控制器 | 0 |
| 集成VCON开关 | 0 |
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