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Technical parameters

Power
Current Rating0.2 A0.26 A
Environment and package
Mated Height0.74 +/- 0.16 mm
Operating Temperature-40 to 85℃ (233 to 358 K)
Other
Applicable Standards (Reference Only)32 Gbps/LaneUSB4 Gen 4 (40 Gbps/Lane PAM3)Thunderbolt 5 (40 Gbps/Lane PAM3)USB4 Gen 3 (20 Gbps/Lane)DisplayPort UHBR20 (20 Gbps/Lane)V-By-One US (16 Gbps/Lane)HDMI 2.1 (12 Gbps/Lane)USB 3.2 Gen 2 (10 Gbps/Lane)DisplayPort UHBR3 (8.1 Gbps/Lane)HDMI 2.0 (6 Gbps/Lane)eDP HBR 2 (5.4 Gbps/Lane)USB 3.1 Gen 1 (5 Gbps/Lane)V-By-One HS 1.4 (4 Gbps/Lane)HDMI 1.3 (3.4 Gbps/Lane)eDP (2.7 Gbps/Lane)MiPi standards
Available Pin CountSignal: 50
Board Pitch0.4 mm
Contact Pitch0.4 mm
Depth6.41 mm
FPC / FFC ThicknessContact Area: 0.25 +0.02/-0.03 mm, Ground Area: 0.37 +0.04/-0.06 mm
FPC TypeShielded FPC
Full EMI Shielding (ZenShield®)Yes
Mating Type / DirectionHorizontal
Mechanical LockYes
Product TypeHorizontal
Transmission Speed (Reference Only)32 Gbps/lane NRZ
Width5.74 + (0.4 x pin count) mm

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