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Technical parameters

Datasheet-verified parameters

20 items
ParameterValue and test conditionsSource
Package32-Lead LFCSP_WQ, 7'' Tape and Reel, 500 Pieces
Operating Temperature Range-40°C to +85°C
RoHSCompliant (Z = RoHS Compliant Part)
Power Supply VoltageMin: 3.0 V, Typ: 3.3 V, Max: 3.6 V
Power Supply CurrentTyp: 139 mA, Max: 155 mA (Locked to 1.25 Gb/s)
Data RateMin: 10 Mb/s, Max: 1250 Mb/s
Differential Input SensitivityMin: 6 mV p-p, Typ: 3.3 mV p-p (2^23-1 PRBS, ac-coupled, BER = 1x10^-10)
Input Voltage RangeMin: 1.8 V, Max: 2.8 V (@ PIN or NIN, dc-coupled)
Input Common-Mode LevelMin: 2.3 V, Typ: 2.5 V, Max: 2.8 V (DC-coupled)
Input ResistanceTyp: 100 Ω (Differential)
Input CapacitanceTyp: 0.65 pF
Loss-of-Signal Detect RangeMin: 2.3 mV, Typ: 3.5 mV, Max: 4.7 mV (R_THRESH = 100 kΩ)
LOS Assert TimeTyp: 500 ns (DC-coupled)
LOL Response TimeTyp: 200 μs (GbE)
Acquisition TimeTyp: 1.5 ms (GbE, Lock-to-Data Mode)
Absolute Maximum Ratings - Supply Voltage4.2 V
Absolute Maximum Ratings - Maximum Junction Temperature125°C
Storage Temperature Range-65°C to +150°C
Thermal Resistanceθ_JA = 28°C/W (32-LFCSP, 4-layer board with exposed paddle soldered to VEE)
ESD ProtectionProprietary ESD protection circuitry
All parameters (18)ExpandCollapse
Power
Voltage - Supply3V ~ 3.6V
AC and DC characteristics
Frequency - Max1.25GHz
Environment and package
Mounting TypeSurface Mount
Operating Temperature-40°C~85°C
PackageTape & Reel (TR); Cut Tape (CT); Digi-Reel®
Package / Case32-WFQFN Exposed Pad, CSP
Supplier Device Package32-LFCSP-WQ (5x5)
Other
Base Product NumberADN2813
Differential - Input:OutputYes/Yes
InputCML
Main PurposeSONET/SDH
MfrAnalog Devices Inc.
Number of Circuits1
OutputLVDS
PLLYes
Product StatusActive
Ratio - Input:Output1:2
Series-

Pinout and package

\* THERE IS AN EXPOSED PAD ON …
\* THERE IS AN EXPOSED PAD ON …
Package: 32-Lead LFCSP_WQ, 7'' Tape and Reel, 500 Pieces
PinNameFunctionSource
1VCC: Connect to VCC
2VCC: Power for Limiting Amplifier, LOS
3VREF: Internal VREF Voltage. Decouple to GND with a 0.1 μF capacitor
4NIN: Differential Data Input. CML
5PIN: Differential Data Input. CML
6SLICEP: Differential Slice Level Adjust Input
7SLICEN: Differential Slice Level Adjust Input
8VEE: GND for Limiting Amplifier, LOS
9THRADJ: LOS Threshold Setting Resistor
10REFCLKP: Differential REFCLK Input. 10 MHz to 160 MHz
11REFCLKN: Differential REFCLK Input. 10 MHz to 160 MHz
12VCC: VCO Power
13VEE: VCO GND
14CF2: Frequency Loop Capacitor
15CF1: Frequency Loop Capacitor
16LOL: Loss-of-Lock Indicator. LVTTL active high
17VEE: FLL Detector GND
18VCC: FLL Detector Power
19SADDR5: Slave Address Bit 5
20SCK: I2C Clock Input
21SDA: I2C Data Input
22LOS: Loss-of-Signal Detect Output. Active high. LVTTL
23VEE: Output Buffer, I2C GND
24VCC: Output Buffer, I2C Power
25CLKOUTN: Differential Recovered Clock Output. LVDS
26CLKOUTP: Differential Recovered Clock Output. LVDS
27SQUELCH: Disable Clock and Data Outputs. Active high. LVTTL
28DATAOUTN: Differential Recovered Data Output. LVDS
29DATAOUTP: Differential Recovered Data Output. LVDS
30VEE: Phase Detector, Phase Shifter GND
31VCC: Phase Detector, Phase Shifter Power
32VCC: Connect to VCC
Exposed PadPad: Connect to GND. Works as a heat sink

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