Comair RotronUnited States
HEATSINK STAMP 22.9X8X10.2MM
All alternatives
View full reportTechnical parameters
| Environment and package | |
|---|---|
| Fin Height | 0.400" (10.16mm) |
| Package | Bulk |
| Package Cooled | TO-252 (DPak) |
| Power Dissipation @ Temperature Rise | 2.5W@35°C |
| Thermal Resistance @ Forced Air Flow | 17.50°C/W @ 300 LFM |
| Thermal Resistance @ Natural | - |
| Other | |
| Attachment Method | SMD Pad |
| Diameter | - |
| Length | 0.315" (8.00mm) |
| Material | Copper |
| Material Finish | Tin |
| Mfr | Comair Rotron |
| Product Status | Obsolete |
| Series | - |
| Shape | Rectangular, Fins |
| Type | Top Mount |
| Width | 0.900" (22.86mm) |