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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Storage/Refrigeration Temperature | - |
| Other | |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter | 0.015" (0.38mm) |
| Digi-Key Storage | - |
| Flux Type | No-Clean |
| Form | Spool, 8.8 oz (250g) |
| Melting Point | 423°F (217°C) |
| Mfr | Harimatec Inc. |
| Process | Lead Free |
| Product Status | Active |
| Series | C400 |
| Shelf Life | - |
| Shelf Life Start | - |
| Shipping Info | - |
| Type | Wire Solder |
| Weight | - |
| Wire Gauge | 27 AWG, 28 SWG |
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