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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Storage/Refrigeration Temperature | 59°F~86°F(15°C~30°C) |
| Other | |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter | 0.032" (0.81mm) |
| Flux Type | No-Clean |
| Form | Spool, 1 lb (454 g) |
| Melting Point | 423°F (217°C) |
| Mfr | Harimatec Inc. |
| Process | Lead Free |
| Product Status | Active |
| Series | C400 |
| Shelf Life | - |
| Shelf Life Start | - |
| Shipping Info | - |
| Type | Wire Solder |
| Weight | 0.55 lb (249.48 g) |
| Wire Gauge | 20 AWG, 21 SWG |
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