Harimatec Inc.Japan
97SC 400 2% .022DIA 23AWG
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Storage/Refrigeration Temperature | 59°F ~ 86°F (15°C ~ 30°C) |
| Other | |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter | 0.022" (0.56mm) |
| Flux Type | No-Clean |
| Form | Spool, 8.8 oz (250g) |
| Melting Point | 423°F (217°C) |
| Mfr | Harimatec Inc. |
| Process | Lead Free |
| Product Status | Active |
| Series | C400 |
| Shelf Life | - |
| Shelf Life Start | - |
| Shipping Info | - |
| Type | Wire Solder |
| Weight | 0.55 lb (249.48 g) |
| Wire Gauge | 23 AWG, 24 SWG |