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Technical parameters

Environment and package
PackageBulk
Size / Dimension4.24" L x 1.28" W (107.7mm x 32.5mm)
Other
Board Thickness0.062" (1.58mm)
Circuit Pattern-
Edge Contacts-
Hole Diameter0.038" (0.97mm)
MaterialFR4 Epoxy Glass
MfrSerpac
Pitch0.100" (2.54mm)
PlatingNon-Plated Through Hole (NPTH)
Product StatusObsolete
Proto Board TypeBreadboard, Prepunched Insulating
Series-

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