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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Storage/Refrigeration Temperature | 59°F~86°F(15°C~30°C) |
| Other | |
| Composition | Sn63Pb37 (63/37) |
| Diameter | 0.015" (0.38mm) |
| Flux Type | No-Clean |
| Form | Spool, 8.8 oz (250g) |
| Melting Point | 361°F (183°C) |
| Mfr | Harimatec Inc. |
| Process | Leaded |
| Product Status | Active |
| Series | C400 |
| Shelf Life | - |
| Shelf Life Start | - |
| Shipping Info | - |
| Type | Wire Solder |
| Weight | 0.551 lb (249.93 g) |
| Wire Gauge | 27 AWG, 28 SWG |
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