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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Size / Dimension | - |
| Other | |
| Board Thickness | - |
| Material | - |
| Mfr | Seeed Technology Co., Ltd |
| Number of Positions | 80 |
| Pitch | 0.031" (0.80mm) |
| Product Status | Active |
| Proto Board Type | SMD to Plated Through Hole |
| Series | - |
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