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Technical parameters

Environment and package
PackageBulk
Size / Dimension3.24" L x 1.88" W (82.3mm x 47.8mm)
Other
Board Thickness0.065" (1.65mm)
Circuit Pattern-
Edge Contacts-
Hole Diameter0.038" (0.97mm)
Material-
MfrSerpac
Pitch0.100" (2.54mm)
PlatingNon-Plated Through Hole (NPTH)
Product StatusObsolete
Proto Board TypeBreadboard, Prepunched Insulating
Series-

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