All alternatives
View full reportTechnical parameters
| Environment and package | |
|---|---|
| Fin Height | - |
| Package | Bulk |
| Package Cooled | FPGA |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | - |
| Thermal Resistance @ Natural | - |
| Other | |
| Attachment Method | - |
| Diameter | - |
| Length | - |
| Material | - |
| Material Finish | - |
| Mfr | CTS Thermal Management Products |
| Product Status | Obsolete |
| Series | - |
| Shape | - |
| Type | - |
| Width | - |
Documents
No documents are linked to this part yet.