Wakefield-VetteUnited States
HEATSINK DPAK SMT TIN PLATED
All alternatives
View full report1 alternatives on file. Sign in to view them.
Technical parameters
| Environment and package | |
|---|---|
| Fin Height | 0.360" (9.14mm) |
| Package | Bulk |
| Package Cooled | D²Pak (TO-263), SOL-20, SOT-223, TO-220 |
| Power Dissipation @ Temperature Rise | 1.0W@55°C |
| Thermal Resistance @ Forced Air Flow | 16.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 55.00°C/W |
| Other | |
| Attachment Method | SMD Pad |
| Diameter | - |
| Length | 0.740" (18.80mm) |
| Material | Copper |
| Material Finish | Tin |
| Mfr | Wakefield-Vette |
| Product Status | Obsolete |
| Series | 217 |
| Shape | Rectangular |
| Type | Top Mount |
| Width | 0.600" (15.24mm) |