Aries ElectronicsUnited States
CONN IC DIP SOCKET 20POS GOLD
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View full reportTechnical parameters
Key specs
Pitch2.54 mm
Current rating3 AMax
| Power | |
|---|---|
| Current Rating (Amps) | 3 A |
| Environment and package | |
| Mounting Type | Through Hole, Right Angle, Horizontal |
| Operating Temperature | -55°C~105°C |
| Package | Bulk |
| Other | |
| Base Product Number | 20-820 |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
| Contact Finish Thickness - Post | 200.0µin (5.08µm) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Contact Resistance | - |
| Features | Closed Frame |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mfr | Aries Electronics |
| Number of Positions or Pins (Grid) | 20 (2 x 10) |
| Pitch - Mating | 0.100" (2.54mm) |
| Pitch - Post | 0.100" (2.54mm) |
| Product Status | Active |
| Series | Vertisockets™ 800 |
| Termination | Solder |
| Termination Post Length | 0.140" (3.56mm) |
| Type | DIP, 0.3" (7.62mm) Row Spacing |