TE ConnectivitySwitzerland
CONN RCPT 2POS 0.031 GOLD SMD
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View full reportTechnical parameters
Key specs
Positions2
Rows1
Pitch800 µm
GenderFemale
Current rating500 mAMax
| Power | |
|---|---|
| Current Rating (Amps) | 0.5A |
| Voltage Rating | 30V |
| Environment and package | |
| Insulation Height | 0.055" (1.40mm) |
| Mated Stacking Heights | - |
| Mounting Type | Surface Mount |
| Operating Temperature | -25°C ~ 85°C |
| Package | Tape & Reel (TR) Cut Tape (CT) Digi-Reel® |
| Other | |
| Applications | General Purpose |
| Base Product Number | 1981813 |
| Connector Type | Receptacle |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 12.0µin (0.30µm) |
| Contact Finish Thickness - Post | 1.97µin (0.050µm) |
| Contact Length - Post | - |
| Contact Material | Phosphor Bronze |
| Contact Shape | - |
| Contact Type | Outer Shroud Contact |
| Fastening Type | Detent Lock |
| Features | Solder Retention |
| Ingress Protection | - |
| Insulation Color | Black |
| Insulation Material | Liquid Crystal Polymer (LCP), Halogen Free |
| Material Flammability Rating | UL94 V-0 |
| Mfr | TE Connectivity AMP Connectors |
| Number of Positions | 2 |
| Number of Positions Loaded | All |
| Number of Rows | 1 |
| Pitch - Mating | 0.031" (0.80mm) |
| Product Status | Active |
| Row Spacing - Mating | - |
| Series | Micro SLP |
| Style | Board to Cable/Wire |
| Termination | Solder |
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