All alternatives

View full report

Technical parameters

Environment and package
Mounting FeatureNormal, Standard - Top
Mounting TypeThrough Hole
PackageTray
Other
Connector StyleDIMM
Contact FinishGold
Contact Finish Thickness15.0µin (0.38µm)
FeaturesBoard Lock, Latches
Memory TypeDDR3 SDRAM
MfrTE Connectivity AMP Connectors
Number of Positions240
Product StatusObsolete
Series-
Standards-

Documents