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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Storage/Refrigeration Temperature | - |
| Other | |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter | - |
| Digi-Key Storage | - |
| Flux Type | No-Clean |
| Form | Jar, 17.64 oz (500g) |
| Melting Point | 423°F (217°C) |
| Mesh Type | - |
| Mfr | Harimatec Inc. |
| Process | Lead Free |
| Product Status | Obsolete |
| Series | HF212 |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | - |
| Type | Solder Paste |
| Wire Gauge | - |
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