Aries ElectronicsUnited States
SOCKET ADAPTER SOIC TO 18DIP 0.3
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Mounting Type | Through Hole |
| Operating Temperature | - |
| Package | Bulk |
| Other | |
| Base Product Number | 18-3500 |
| Board Material | Polyimide (PI) |
| Contact Finish - Mating | Tin |
| Contact Finish - Post | Tin-Lead |
| Contact Finish Thickness - Mating | - |
| Contact Finish Thickness - Post | 200.0µin (5.08µm) |
| Contact Material - Mating | - |
| Contact Material - Post | Brass |
| Convert From (Adapter End) | SOIC |
| Convert To (Adapter End) | DIP, 0.3" (7.62mm) Row Spacing |
| Features | - |
| Housing Material | - |
| Material Flammability Rating | - |
| Mfr | Aries Electronics |
| Number of Pins | 18 |
| Pitch - Mating | 0.050" (1.27mm) |
| Pitch - Post | 0.100" (2.54mm) |
| Product Status | Active |
| Series | Correct-A-Chip® 350000 |
| Termination | Solder |
| Termination Post Length | 0.125" (3.18mm) |